• MICROCOAT BACKGROUND
  • Sam Forman Background
• INDIVIDUAL PRODUCT SLIDE PRESENTATIONS
  • MCT 34T71ND-2
  • MCT 54-4103
  • MCT 61075
  • MCT SD0802-31DA
  • MCT 2-0404-33
• M-COAT PRESENTATION (.PDF FORMATS)
  • 2022 MCT Presentation
  • M-Coat Sell Sheet
  • M-Coat Presentation Microelectronics & Semiconductors
  • M-Coat Presentation UV Materials Only
  • 3D Die Stacking Presentation (See 3D Die Stacking Below)
  • UV Cure Conformal Coating vs Solvent Base Coating
• SELECTOR GUIDES
  • UV CURE MEDICAL ADHESIVES
  • PLASTIC BONDERS
  • Conductive Adhesives (40)
  • UV Cure Coatings and Adhesives (>1500)
  • Glass Bonding Selector (>70)
  • MCT Anisotropics
  • Industrial Adhesives
  • Armature Balancing Compounds
  • Optically Clear Selector Guide-n
  • Glob Tops - UV Cure Only, UV/Heat, Heat Only
• MICROELECTRONICS / SEMICONDUCTOR ASSEMBLY
• FINE CONDUCTIVE DOTS FOR BGA'S & MEM'S
  • SD0802-31
  • Fine Conductive Dots for MEMs
• DOWN-HOLE VERY HI TEMP -- TG >300C
  • HIGH TEMP CONDUCTIVE
  • HI TEMP NON-CONDUCTIVE
• CONDUCTIVE DIE ATTACH SERIES
  • First Choice for Conductive Die Attach
  • 2-0404/33-HTC Conductive Die Attach - TC >11W/mK
  • 2-0404-3315 Standard for Conductive die Attach
  • 2-8190 Conductive Die Attach
  • MEMS3304 Conductive Adhesive For MEMS
  • MCT 2-0404-15SC Snap Cure Conductive Die Attach
• SINTERED SILVER DIE ATTACH
  • Sintered silver die attach adhesive
• NO BLEED DIE ATTACH ADHESIVE
  • CONDUCTIVE
  • NON-CONDUCTIVE
  • HIGH THERMALLY CONDUCTIVE
  • Sub-Micron Conductive Adhesive
• NON-CONDUCTIVE DIE ATTACH SERIES (>45)
  • First Choice for Non-Conductive Die Attach
  • MCT 36190 DA-1 Non-Conductive Die Attach
  • MCT 34-31-HTSM High TC Non-Conductive Die Attach
  • MCT 3638-HT Non-Conductive Die Attach Adhesive TC= 4W/mK
  • MCT 9232-SFDA Non-Conductive Self filleting Die Attach
• MICROELECTRONICS ASSEMBLY & SEALING (14)
  • Package Sealing Ceramic/Ceramic and Ceramic/Kovar
  • 650C Conductive Adhesive - Replaces Ag/Glass in many apps
  • SMD Conductive Adhesives
  • Thick Film Green Overcoat Glass Replacement
  • Possible Ag/Glass replacement
• GLOB TOPS (20)
  • Clear Silicone Globtop/ MCM Fill
  • Optically Clear UV Cured GT E-54050
  • 341014 HTGT
  • COB Glob Top Series
• BGA / FLIPCHIP UNDERFILL
  • 9116CUFL
• OPTOELECTRONICS (15)
  • SILICONE LIGHT PIPE SYSTEM
  • How an optocoupler works
  • LED & IC Coating
  • Clear Glob Top
  • Tri Colored Lightpipe System
  • Optical Alignment UV cure Adhesive
  • ppt. Presentation
• 3D DIE STACKING CONDUCTIVE INTERPOSER (4)
  • MICROCOAT & GPD DISPENSE 70UM LINES FOR STACKED DIE CONNECTORS
  • 3D SD0802 Series
  • 3D Die Stacking
• MEDICAL (> 100)
  • General Adhesives 423-06
  • General Adhesivee 54-177-1
  • Hearing Aid Coatings
  • Ag-Cl for Medical Apps
  • UV Cure Medical Grade Class VI Adhesives
• INDUCTOR COATINGS (4)
  • 33790
  • SuperCure 87153-1
• SENSORS (8)
  • AgCl for Sensors
  • Electrode Inks (No Films)
• ELECTRONICS COATINGS ETC. (>200)
  • Thermoelectric (12)
  • Motor Balancing
  • Epoxies, General
  • Urethanes
  • Potting & Encapsulating
  • UV Cure (See Selector Guide)
• SUPER HI TEMP ADHESIVES
  • MCT QS458-HV
  • MCT A795 CONDUCTIVE
• ELECTRICAL (150)
  • Switch Coating for "Hermiticity"
  • Armature Balancing
• EQUIPMENT
  • NEW HAND HELD 400W UV CURE UNIT
  • UVITRON LED RADIOMETERS
  • Conveyors
  • Dispense and Fill Systems
  • Controllable Dispenser (EFD Replacement)
  • UVITRON SYSTEMS
  • Techon precision dispensing
  • TECHON 1:1/2:1 etc DISPENSING
• APPLICATION NOTES
  • EMI/RF MITIGATION
  • Silver Epoxy Turns Black.... So What????
  • Viscosity, Rheology, Thixotropy????
  • Thermal Conductivity
  • Measuring & Understanding Tg
  • Determining Specific Gravity (SpGg)
  • Shore A - D Conversion
  • Liquid Crystal Package (LCP) Cleaning for Sealing
  • SURFACE PREPARATION FOR IMPROVED ADHESION - Nordson
  • Adhesive and Cohesive Forces in Glue
  • Development of conducting adhesive materials for microelectronic applications
  • Plasma Clean Tech Article for Bonding - Dr. J. Getty March Plasma
  • Advances in UV curing for Med Apps
  • What is DMA?
  • UV Cure Technology
  • Why Use UV Cure Materials
  • UV Radiation
  • A Dot of Material - Volume
  • A Bead of Material - Volume
  • A Little About Light
  • The Electromagnetic Spectrum
  • Tin Whisker Mitigation
  • A Little About Silver
  • The Effect of Coating and Potting on the Reliability of QFN Devices DfR Solutions
  • ICSR Slides Greg Caswell DfR Solutions
  • COB Glob Tops
  • Storing & Handling Frozen Syringes
• ROHS & WEEE
  • Restriction on Hazardous Substances
• YOUR MCT INSIDE SALES CONTACT(S) KILEY, LOGAN, ADDISON, NOAH; SALES@M-COAT.COM
  • sales@m-coat.com
• SALES REPS AND DISTRIBUTORS
  • NY, No. NJ, E. PA Tom T. t2@gmsystems.com
  • Colorado & Utah Dave K dave@alphatek-inc.com
  • Texas - Jim P - psitx@sbcglobal.net
  • No. Midwest - Nick Wagner
  • Puerto Rico, Dominica Jorge Acevedo jorge@advprotech.com
  • SYST-CORP; Costa Rica, Nicaragua, Honduras, Guatamala, Belize, and El Salvador; info@syst-corp.com
  • Sweden, Norway, Finland, Denmark, Poland, Iceland Are B. - are.bjorneklett@aprtec.com
  • Estonia, Latvia, Lithuania, Spain, France, Great Britain - Peter N.
  • The Netherlands, Austria, Switzerland, Italy, Germany - Robert T.
  • Israel Arie H arie@highrel.com
  • CHINA: Shanghai Zhenwei Chemicals CO., LTD
  • Philippines, Malaysia, Thailand, Indonesia, Taiwan - MEGACHIPSEM CORP bpadel@megachipsem.com
  • Philippines,(2): KEY ELECTROCHEM LIMITED; Email: edmund@keyelectrochem.com
  • Singapore; :Accurex Technologies; +6596388598; Email:gncs@accurex.com.sg
• TECHON