MicroCoat Technologies flexes its high-tech muscle with military, medical, aerospace, down-the-hole, solar, etc. adhesives and coatings. The company's diverse offerings include UV, Thermal & Air Cure Coatings and Adhesives for the SMD/PCB Assembly, Microelectronics - Chip and Wire, Die Attach, and for virtually any industry. The company's largest customer base is in the US and MCT does about 85% of their business onshore. Headquarters is in McKinney, Texas with satellite facilities in CT and NC. Below are but a few of our >1200 formulations for high tech applications

                                                                                 MCT 2-8190-P
                      A High Performance Single Component, Non Frozen Conductive Epoxy For Die Attach
Approved to 20+GHZ and an Operating Temperature Range of -55^oC to +200^oC
MicroCoat 3890 ( 2-8190-DJ) is a one part thermosetting conductive epoxy designed primarily for die attaching semiconductors and surface mount devices in military, “down-the-hole” hybrids, optoelectronics, automotive sensors and transducers, etc. The material is a thixotropic paste which may be applied by screen printing or syringe. It is 100% solids, and posses’ good handling and storage properties. This silver-filled conductive die attach adhesive is designed to bond ICs and components to advanced substrates such as ceramic, PBGAs, CSPs and array packages. Hydrophobic and stable at high temperatures, the adhesive produces a void-free bond line with excellent interfacial adhesion strength to a wide variety of organic and metal surfaces including solder mask, BT, FR, polyimide, gold, Kapton and Mylar. This material is formulated to provide high cohesive energy, adhesive strength, and elongation at break. Short term at 260^oC (2-3 minutes for Pb free reflow) OK if cured at 150^oC for 60 minutes

                                              MicroCoat DAXX Series Microelectronic Die Attach Adhesive
A Single Component, NON-Frozen, Toughened, Microelectronic Grade Die Attach Adhesive with a Service Temperature of <-65^oC to Over >340°C and Meets NASA Low Outgassing Specifications and has the same characteristics as the MCT 3890 conductive silver

                                                MicroCoat 340X Series Microelectronic Package Sealant
A One Component, Toughened, Cryogenic Epoxy Adhesive/Sealant Featuring High Peel and Shear Strength, and Exceptional Serviceability with Working Temperatures of 4°K to Over >315°C and Meets NASA Low Outgassing Specifications for use as a Microelectronic Package Sealant

Literally Hundreds of Combinations of Materials for the Microelectronics,   Optoelectronics, Semiconductor, Medical, and Commercial Industries